Treating Machine
VacuTEC-5050
product features:
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·Easy installation ·Simple to use ·Fast processing speed ·Vacuum degree ·Access to auxiliary gas ·Process control ·Low cost processing |
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Tantecs VacuTEC 5050Vacuum plasma processing is suitable for the processing of larger injection molding products of different materials. The fast processing speed of this equipment provides the best product surface energy and good combination for the layers, glue, printing, spraying of downstream processes.
The vacuum cavity of the device and the intelligent integrated plasma electrode are combined to achieve the precise discharge of the plasma in the state of 0.1-- 3Mbar. At the same time, the processing time is very short. In general, there are different combinations for different materials. Around 20-120 seconds.
VacuTEC2020Vacuum plasma processing equipment has the advantages of simple operation and fast production and processing speed. Auxiliary gases such as argon and oxygen can be added during the process to improve the surface treatment effect, but in most cases, because high-power plasma discharge generally does not require gas to assist in participation.
VacuTEC2020The advanced Tantec host HV-X series is used as the power supply, and the specially designed high-frequency high-voltage transformer provides powerful power output for the plasma electrode.
TantecNot only standard vacuum technology equipment, but also custom-designed equipment. The vacuum technology custom machine is specially developed according to customer standards to 100% adapt to the customer's production line.
Features：
·Easy installation Just connect power and compressed air.
·Fast processing speed Efficient output power can achieve different materials can be processed quickly in 20-120 seconds.
·Easy maintenance This equipment is easy to install, easy to operate and easy to maintain.
·The design of the cavity door adopts the design of hinge connection and window.
·Scope of application It can be applied to any material surface of conductor and non-conductor.
·Low-cost process requires almost no auxiliary gas
·Process monitoring The HV-X host and PLC monitor the entire process in real time. All parameters are displayed on the touch screen.
·The degree of vacuum can be set freely between 0.1-3Mba for different materials plasma equipment release area.
·Auxiliary gas During the process, auxiliary gases such as argon, oxygen, and nitrogen can be added, but they are generally not required.
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